Tsinghua and Intel to Develop New General-Purpose Processor
An agreement to develop a new generation CPU module has been signed by Tsinghua University, Intel Corporation and Montage Technology Global Holdings. Tsinghua University will be responsible for developing a reconfigurable computing processor (RCP) module and associated system software that will work with a standard Intel Xeon microprocessor. The R&D will be funded by Intel and Montage Technology to promote the commercialization of the new products and deliver them to the Chinese market in 2017. The joint collaboration for the project dates back to 2015 when their jointly-developed core technology won the second prize for the 2015 State Technological Invention Award and the 2015 China Gold Patent Award.